Title page for ETD etd-11152005-222951

Type of Document

Master's Thesis

Author

Wen, Shirong

Author's Email Address

swen2@lsu.edu

URN

etd-11152005-222951

Title

The Electrodeposition and Property Study of Nickel-Rhenium Alloy

Degree

Master of Science in Engineering Science (M.S.E.S.)

Department

Engineering Science (Interdepartmental Program)

Advisory Committee

Advisor Name	Title
Wanjun Wang	Committee Chair
Ashok Srivastava	Committee Member
Wen Jin Meng	Committee Member

Keywords

electrodeposition
nickel-rhenium alloy
thermal stability
microstructural characterization
high temperature

Date of Defense

2005-11-10

Availability

unrestricted

Abstract

The electrodeposition of nickel-rhenium alloys from Ni(II) and Re(VII) solution was studies in an aqueous acidic solution. Different plating current density and pH have been carried out, and the effect of them on the composition of the deposited Ni-Re alloy was studied. Wavelength-dispersive spectrometer (WDS) was used to measure the composition of Ni-Re alloy. The thermal stability of nickel-rhenium alloy system has been investigated. Differential scanning calorimetry (DSC) tests have been conducted for the electroplated Ni-Re samples in order to find the possible heating initiated interactions at elevated temperatures. To investigate the thermal stability of Ni-Re alloys, the samples were annealed under nitrogen environment for 90 minutes at 280°C, 350°C, 600°C and 900°C. Transmission electron microscopy (TEM) was used to exam the microstructures of Ni-Re alloy samples as-deposited and heat-treated. The results show that the as-deposited Ni-Re material grain size for this plating condition is around 380nm. The results also show that after heating at 600°C for 90 minutes, there was no significant grain growth observed. The microhardness and nanohardness of Ni-Re alloy were also studied with as-deposited and heat-treated samples. Tensile strength was carried out by dynamic mechanical analyzer (DMA) at room temperature and elevated temperature of 400°C. This research demonstrated a well developed, thermally stable and mechanically sound material system for LIGA/MEMS high temperature robust applications.

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