Title page for ETD etd-11152005-222951

Type of Document Master's Thesis
Author Wen, Shirong
Author's Email Address swen2@lsu.edu
URN etd-11152005-222951
Title The Electrodeposition and Property Study of Nickel-Rhenium Alloy
Degree Master of Science in Engineering Science (M.S.E.S.)
Department Engineering Science (Interdepartmental Program)
Advisory Committee
Advisor Name Title
Wanjun Wang Committee Chair
Ashok Srivastava Committee Member
Wen Jin Meng Committee Member
  • electrodeposition
  • nickel-rhenium alloy
  • thermal stability
  • microstructural characterization
  • high temperature
Date of Defense 2005-11-10
Availability unrestricted
The electrodeposition of nickel-rhenium alloys from Ni(II) and Re(VII) solution was studies in an aqueous acidic solution. Different plating current density and pH have been carried out, and the effect of them on the composition of the deposited Ni-Re alloy was studied. Wavelength-dispersive spectrometer (WDS) was used to measure the composition of Ni-Re alloy. The thermal stability of nickel-rhenium alloy system has been investigated. Differential scanning calorimetry (DSC) tests have been conducted for the electroplated Ni-Re samples in order to find the possible heating initiated interactions at elevated temperatures. To investigate the thermal stability of Ni-Re alloys, the samples were annealed under nitrogen environment for 90 minutes at 280C, 350C, 600C and 900C. Transmission electron microscopy (TEM) was used to exam the microstructures of Ni-Re alloy samples as-deposited and heat-treated. The results show that the as-deposited Ni-Re material grain size for this plating condition is around 380nm. The results also show that after heating at 600C for 90 minutes, there was no significant grain growth observed. The microhardness and nanohardness of Ni-Re alloy were also studied with as-deposited and heat-treated samples. Tensile strength was carried out by dynamic mechanical analyzer (DMA) at room temperature and elevated temperature of 400C. This research demonstrated a well developed, thermally stable and mechanically sound material system for LIGA/MEMS high temperature robust applications.
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