Type of Document	Master's Thesis
Author	Namburi, Lakshmikanth
Author's Email Address	namburi_lk@hotmail.com
URN	etd-1109101-100345
Title	Electrodeposition of NiW Alloys into Deep Recesses
Degree	Master of Science in Chemical Engineering (M.S.Ch.E.)
Department	Chemical Engineering
Advisory Committee	Advisor Name Title Elizabeth J. Podlaha Committee Chair Kevin W. Kelly Committee Member Robin McCarley Committee Member
Keywords	alloys for MEMS high aspect ratio plating MEMS materials
Date of Defense	2001-10-26
Availability	unrestricted
Abstract Pulse electrodeposition has been investigated as a general technique for the electrodeposition of nickel-tungsten alloys in deep recesses for MEMS. Ni-W exhibits an induced codeposition mechanism, where the Ni reaction rate enhances the codeposition of W. Electrodeposition of this alloy has been achieved into recesses of 500 micron deep. The challenges that have been encountered are those related to gas evolving side reactions, local pH rises, diffusional limitations of the soluble species and long times required for filling the recesses. Electrodeposition on cylinder electrodes at different rotation rates was also carried out in order to obtain data on composition of the alloy and current efficiency of the process, for different baths considered. These studies were carried out to examine the suitability of the bath for microstructure development and to describe better how the codeposition processes is affected by mass transport.
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